Advises on adhesion and bonding process quality
Before bonding materials, it's important to take different factors in consideration.
- The substrate should be clean (not dusty) not plastified and not oily. Moreover, it's important to know that a rough substrate requires a thicker adhesive tape.
- Bonding should be done in an dry environment with temperature in between 18°C and 30°C.
- The storage of adhesive tapes should be done in the same condition as their application.
Advises for bonding on usual materials.
Usually, most materials could properly be bounded, but some are said "anti-adhesion". It's the case of non-ferrous metals, teflons, and plastified materials.
- On materials such as aluminium and non-ferrous metals, apply a inked rag, wipe the substrate, and check if some traces are left. If it's the case, realize a try adhesive test before completely applying the adhesive tape.
- Substrates should be cleaned, dried and should not contain any plastic component.
- It's better to apply the adhesive tape in a dry environment with a temperature in between 18°C and 30°C.